SSAIL

Highly customizable micromachining systems, micrometer scale machining precision, modern design.

How does it work?

SSAIL is a two-step process:

1. Surface of the part is activated by laser
2. Chemical activation
   1. Electrochemical plating
   2. Standard chemical electroplating process

Flexibility of shapes

SSAIL technology enables forming conductive traces on different form factors:

• 3D surfaces

• Thin films

• Flexible materials

• Transparent materials

• From 1μm width traces to large conductive areas

Standard materials

SSAIL technology works on standard dielectric materials: various polymers, glass, silicon, ceramics.
No metal additives are needed.

Materials tested

PC/ABS	PPS	Genitax
PA6	PF	FR-4
PVC	PI	Epoxy
PMMA	PC/ ABS for 3D printing	RO3003TM Laminates
PET	PTFE	SITAL ceramic
PEEK	ABF	AL2O3 ceramic
PPA	PA4	Glass (soda lime)
LCP	PBS	Fused Silica
PBT	PREP 200	Silicon

High adhesion strength

Conductive traces formed with SSAIL technology has a high adhesion strength and environmental resistance. This allows using it on flexible materials as well as in real-world environments.

No:	Material	Adhesion strength
1	PEEK	3610 N/cm2
2	LCP	1630 N/cm2
3	Glass	2720 N/cm2
4	Sital ceramic	730 N/cm2
5	PET	680N/cm2
6	PMMA	1030 N/cm2
7	PC/ABS	690 N/cm2